![]() This course reviews the equipment, test set-ups and primary coupling mechanisms associated with each of the major electromagnetic compatibility tests. Course Outline The Physics of Electromagnetic Compatibility Measurements Finally, examples of good and bad power circuit designs ranging from low-voltage DC-to-DC converters to 700-volt electric vehicle motor drives are reviewed. Active noise cancellation techniques applicable in various situations are also presented. The focus of the afternoon session is on advanced design concepts including grounding strategies, component selection and placement, and methods for maintaining electrical balance. Noise source models are presented and various noise mitigation options are examined. In the morning session, basic power electronic circuit topologies and applications are reviewed with a focus on the fundamental properties of these circuits that result in unwanted conducted and radiated emissions. This course covers fundamental and advanced design concepts related to the design of power electronic circuits for meeting electromagnetic compatibility requirements. Power Electronics Design for Electromagnetic Compatibility They will also be introduced to tools and techniques for quickly reviewing designs in order to flag potential problems well before the first hardware is built and tested. Students completing the course will be able to make good decisions regarding board layout and system design for EMC. This course stresses the fundamental concepts and tools that electronics engineers can employ to avoid electromagnetic compatibility and signal integrity problems. ![]() Minor mistakes in the layout of these boards can mean the difference between a reliable product and a product with severe EMC problems. Mixed-signal boards require that special attention be paid to the routing of the low-frequency currents. Many electronic systems employ mixed-signal boards (boards with both analog and digital circuits). Taking the time to ensure that components are properly placed, transition times are not left to chance, and traces are optimally routed will generally result in products that meet all electromagnetic compatibility and signal integrity requirements on time and on budget. Boards that are auto-routed or laid out according to a list of “design rules” do not usually meet electromagnetic compatibility requirements on the first pass and the products using these boards are more likely to require expensive fixes such as ferrites on cables or shielded enclosures. Printed circuit board layout is often the single most important factor affecting the electromagnetic compatibility of electronic systems. First-pass compliance with EMC requirements starts with the circuit board layout. Board layout changes and other EMC "fixes" can significantly add to the cost of a product and/or delay its development schedule. Today's rapid development cycles require products to meet their EMC requirements the first time they come into the lab for testing.
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